Wafer temperature measurement equipments are utilized for monitoring the temperature of wafer, during electronics manufacturing. Almost all processes, involved in silicon wafer fabrication and electronics manufacturing, requires effective monitoring and regulation of wafer temperature. The monitoring of temperature is very important in every stage of electronics manufacturing. Changes in temperature, of even 0.1 centigrade can lead to non homogeneity in quality of integrated circuits (ICs) or electronics produced. Additionally, different wafers have different emissivity. The higher the emissivity of a wafer is, the higher amount of energy will be emitted by that wafer. Wafer temperature measurement equipment market has been growing at a steady pace, owing to the increase in size of wafers. The current semiconductor industry is moving towards sub-micron size of circuits, while the wafer size is getting larger for increasing productivity and resource optimization. The increase in size of wafers has also led to increasing demand for in-process measurement and maintenance of wafer temperatures, for maintaining homogeneity of wafer nature throughout the wafer surface. This in turn has been positively impacting the growth of the wafer temperature measurement equipment. Additionally, the increasing complexity of electronic devices has been primarily due to advent of 2.5D and 3D packaging technologies. Such technologies utilize multiple wafers and non homogeneity in wafer quality can lead to a non functioning or a malfunctioning chip.
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This in turn has been boosting the global demand for wafer temperature measurement equipments, in such semiconductor manufacturing facilities. However, with the advent of different wafer materials and packaging technologies, most of wafer temperature measurement equipments currently available today can be termed to have relatively bad signal to noise ratio (SNR).
On the basis of type, the market for wafer temperature measurement equipment has been segmented into contact and non contact types. Non contact wafer temperature measurement equipments segment has been growing at a fast pace and is expected to maintain its fast growth pace, during the forecast period. On the basis of process, the market is segmented into front end of the line (FEOL), back end of the line (BEOL) and both. ‘Both’ segment was the largest segment in 2016, owing to the capabilities of these equipments to function in both FEOL and BEOL processes. By application, the market has been segmented into thin film deposition, process, etching process, lithography process, implant & wet process and others. On the basis of region, the global market for wafer temperature measurement equipment has been segmented into North America, Europe, Asia Pacific (APAC), South America and Middle-East & Africa (MEA).
The major companies of the wafer temperature measurement equipment market globally are KLA-Tencor Corporation (The U.S.), CI Systems, Ltd. (Israel), ASML N.V. (The Netherlands), Applied Material, Inc. (The U.S.) and LAM Research Corporation (The U.S.) among various other companies.
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