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ATS Heat Sink Series Cools LGA Packages
Advanced Thermal Solutions (ATS) now provides a series of heat sinks specially designed for cooling hot, high power LGA (land grid array) components for safer and more reliable performance.
BriefingWire.com, 6/15/2010 -
ATS heat sinks for LGA cooling are built in plus sizes because of the extra space provided by the land grid array design. The heat sinks include models with integral DC fans that provide a continuous airflow source. Each LGA fan/heat sink assembly includes four spring-loaded push pins for direct attachment to the PCB. Passive models of the LGA heat sinks also attach with push pins for convenience. Integral springs on the push pins maintain closure force on the sink, interface pad and component assembly to enhance thermal transfer.
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