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Low Profile Heat Sink Cools ASICs in Tight Packaging Systems
April 16, 2010: Advanced Thermal Solutions (ATS) has introduced the ATS-56002 maxiFLOW® heat sink which is specially designed for cooling hot ASICS in narrow packages where space and airflow are limited.
BriefingWire.com, 4/16/2010 -
April 16, 2010: The ATS-56002 maxiFLOW heat sink features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling without the need for an integral fan. The 56002 heat sink is just 4 mm high; its length and width are both 25 mm. The aluminum sink features a black anodized finish. It comes preassembled with a high performance thermal interface material (TIM) with double-sided adhesive to enhance thermal transfer. The heat sink’s thermal resistance is just 5.2°C/W at 200 ft/min airflow in ducted conditions
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