The first factor is line and drawings which people also call it the pattern. Line is conduction tool which would be used for the connection between the originals and components. In the design process of the circuit board, people will design another large copper surface as the ground and power planes. Plane of the drawing lines are made ??simultaneously.

The second part is the dielectric layer which is also simply called the dielectric. This is used to keep the insulation capability of lines and layers. This part is also commonly known as the substrate. People should remember it because it would be very commonly in the designation of the Mulitlayer printed wiring board.

The third part should be the through hole and via. Via could make the line from more than two layers [url=http://www.5pcb.com/fpccal.html]Flexible PCB calculator[/url] of board become conduction. However, this function is only related to the small size via and through hole. The larger size via would be used as a plug-in part of the electrical components. In addition, there is also another non-conductive through hole which is also known as NPTH. This kind of hole on the circuit board is often used as a surface Mount positioning and assembly with screws.

The Solder Mask or the so-called Solder resistant is another crucial part of the PCB board. Not all of the copper board surface should be equipped with components with the tin. For some area where is very waste of the tin, these places will be printed on a layer of Solder Mask to isolate the tin-wasting surface. Depending on the working process, the Solder Mask could be divided into green oil, red oil and blue oil.

The Legend which has another name such as marking or silk screen is the non- necessary structure and components. The main function of the silk screen is to mark the name of each part of the circuit board and location box. It would let the identification in repairing process become very easy.

The last part should be the Surface Finish. Since the copper surface s very easily to be oxidized in the general environment and it would result in the non-coated of tin, so people should do some measurements to protect the copper surface. There are several ways to protect it such as HASL, IENIG, Immersion Silver, Immersion Tin, OSP and others. Each method has its own advantages and disadvantages.

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