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Pareesh Phulkar

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Diamond Wire Wafer Slicing Machine Market Covering Developing Trends, Forecast By 2026
Diamond wire wafer slicing machine is used to cut silicon wafer by using a high-speed spindle, which is fit with a diamond blade, 9/13/2019 - Diamond wire wafer slicing machine is used to cut silicon wafer by using a high-speed spindle, which is fit with a diamond blade. A dicing saw is equipped with the machine which cuts these wafers into individual chips. Materials that are sliced from these machine are silicon, silicon carbide, gallium nitride, gallium arsenide, and ceramic, among others. These wafers are used for production of semiconductors, which in turn, are used in the manufacturing of electronic components.

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Shortcomings of conventional slicing machine is one of the major factors driving growth of the market

One of the major factors attributed to growth of the market is restraints in using conventional slicing machines including high volume of wastage while cutting the wafer, low speed of slicing the wafer, and low quality of dices. These factors are driving manufacturers to develop advanced wafer slicing machines, to overcome the challenges associated with conventional machine. For instance, in July 2017, Meyer Burger launched ‘DW288’ diamond wire wafer slicing machine. This machine ensures maximum material utilization while cutting and it requires low electricity while production and this machine also not produces any slurry, which is made of polyethylenglycol (PEG) and silicon carbide (SiC), which further helps in reducing the challenges associated with the recycling of silicon wafer.

Additionally, miniaturization of electronic devices is further propelling demand for small size chips to be incorporated in electronic devices, which in turn is driving demand for diamond wire wafer slicing machines, globally. This is due to higher accuracy of these machines to cut a wafer into smaller sizes as compared to conventional slicer machines. For instance,according to a press release of Apple, Inc., in May 2018, the company announced that it is going to use a 7nm (nanometer) chip for next generation iPhone and the processor will be named as ‘A12’ chip. This chip will be much smaller, faster, and more efficient than 10-nanometer chips, which is being used in current Apple devices such as iPhone 8 and iPhone X.Hence, all these factor will help in propelling growth of the market.

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Moreover, presence of key manufacturers such as Samsung, Sony, LG, Toshiba, Panasonic, Toyota, and Honda makes this region largest consumer of semiconductor ICs, which is another major driving factor leading to high demand for diamond wire wafer slicing machine for cutting wafer. Hence, this factor also helps in fuelling growth of the diamond wire wafer slicing machine in this particular region.

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